PCB FABRICATION

PCB Capabilities.

1–40 layer PCBs with blind/buried vias, impedance control,
and HDI capability — prototype to mass production, IPC Class 2/3 certified.

  • 1–40 Layers
  • 3/3 mil Trace/Space
  • HDI Blind/Buried Vias
  • Impedance ±5%
  • 10 oz Copper
  • IPC Class 3
1–40L

Layer Count

3/3mil

Min Trace/Space

0.1mm

Min Drill (Laser)

10 oz

Max Copper

609×889

Max Board (mm)

24HR

Rush Available

Technical Specifications

Capabilities.

Specification Details
Board Type Rigid PCB · Flexible PCB · Rigid-Flex PCB · HDI PCB · Heavy Copper PCB · MCPCB · High-Frequency PCB (1–40 layers)
Materials FR-4 · High Tg FR-4 · Rogers · Teflon · Aluminum · Polyimide
Board Dimensions Min: 10×10mm — Max: 609×889mm
Board Thickness 0.2mm — 6.0mm (common: 0.8mm, 1.6mm)
Min Line Width / Spacing 50μm / 50μm (common: 100μm / 100μm)
Copper Thickness (Outer) 0.5 oz — 10 oz (17μm — 345μm)
Copper Thickness (Inner) 0.5 oz — 4 oz (17μm — 140μm)
Surface Finish HASL · Lead-free HASL · ENIG · Immersion Silver · Immersion Tin · OSP · Hard Gold · Electrolytic Nickel Gold
Solder Mask LPI (Liquid Photo-Imageable) · Dry Film
Solder Mask Colors Green · Blue · Red · White · Black · Matte variants
Silkscreen Colors White · Black · Yellow
Min Drill Size 0.15mm (CNC) · 0.1mm (Laser blind/buried vias)
Drill Tolerance ±0.05mm (standard) · ±0.025mm (advanced)
Aspect Ratio Up to 20:1
Impedance Control Standard: ±10% · Advanced: ±5% (50Ω and below: ±5Ω)
Gold Finger Beveling 30° · 45° · custom angles on request
Quality Standards ISO 9001:2015 · ISO 13485:2016 · ISO 14001:2015 · RoHS · UL 94V-0 · IPC-A-600 · IPC-6012
Turnaround Time Standard: 5–10 days · Rush: 24 hours (subject to complexity)
Specification Details
Layer Count General PCB: 2–40 layers · HDI (7+N+7): staggered and stacked vias · Buried IC: supported
HDI Structure HDI 1–7 steps · Blind/buried vias · Laser micro-vias · Any-layer HDI
Max Board Size 508×889mm (20×35 inch)
Board Thickness 0.21mm — 6.0mm
Min Track / Spacing Inner layer: 2mil / 2mil · Outer layer: 2mil / 2mil
Outer Copper Thickness Up to 8 oz
Inner Copper Thickness Up to 8 oz
Aspect Ratio Up to 12:1 (standard) · 20:1 (advanced)
Min Annular Ring Via: 3mil · Component hole: 5mil
Plug Via Hole Min: 0.15mm (CNC) · 0.1mm (Laser) · Max: 0.7mm
Min SM Bridge (Green) 3mil
Min SM Bridge (Black) 4mil
Impedance Tolerance ±10% standard · 50Ω and below: ±5Ω
V-Cut CNC V-cut: 20° / 30° / 45° / 60°
Dimension Tolerance ±0.1mm
Board Thickness Tolerance 0.21–1.0mm: ±0.1mm · 1.0–2.5mm: ±7% · 2.5–6.3mm: ±6%
Finished Hole Tolerance 0–0.3mm: ±0.08mm · 0.31–0.8mm: ±0.08mm · 0.81–1.60mm: ±0.05mm
X-Ray Inspection Available for all HDI and BGA boards
Specification Details
Base Material FR-4 (Shengyi) · High Tg (Tg-220) · Halogen-free · PTFE · Polyimide · Rogers · Isola
PCB Types Rigid PCB · FPC (Flexible) · Rigid-Flex · HDI
Max Layer Count 40 layers
Min Base Copper 1/3 oz (12μm)
Max Finished Copper 10 oz
Min Trace/Spacing Inner: 2/2mil (H/H oz base) · Outer: 2/2mil (1/3 oz base)
Min BGA Diameter 8mil
Min BGA Pitch 0.4mm
Min Hole Size 0.15mm (CNC) · 0.1mm (Laser blind/buried)
Max Aspect Ratio 20:1
Min Insulating Layer 2mil
Min SM Bridge 3mil
Circuit Processing Film · LDI (Laser Direct Imaging)
HDI & Special Types HDI (1–7 steps) · Rigid-Flex (2–16 layers) · High-frequency mix-pressing (2–20 layers) · Buried capacitance & resistance
Surface Finish ENIG · HASL · Lead-free HASL · OSP · Immersion Sn · Immersion Ag · Hard Gold · Plating Silver
Max PCB Size 609×889mm
Quality Assurance & Control

Certified to the
Highest Standards.

Certifications

Quality Standards

ISO 9001:2015 · ISO 14001:2015 · ISO 13485:2016 · RoHS · UL 94V-0 · IPC-A-600 Class 2/3 · IPC-6012B Class 2/3
Inspection

Testing & Inspection

Flying Probe Testing · AOI · Impedance Testing · X-Ray Inspection · Microsection Analysis · E-Test (100% continuity)

Process

Process Control

Statistical Process Control (SPC) · In-Process Quality Control (IPQC) · Final Quality Control (FQC) · Full traceability documentation