one stop pcba

PCBA Capabilities.

Full in-house service from component sourcing to final assembly
— prototype to mass production, IPC Class 3 certified.

  • IPC-A-610 Class 3
  • ISO 13485
  • 0.35mm BGA Pitch
  • 01005 Components
  • 300K CPH
  • 48hr Prototype
01005

Min Component Size

0.35mm

Min BGA Pitch

±0.025mm

Placement Accuracy

300K

CPH Capacity

48HR

Prototype

IPC3

Class 3 Certified

Technical Specifications

Assembly Capabilities.

Parameter Specification
SMT Production Lines 4 High-speed Automated SMT Lines
Daily Capacity 300,000 CPH (Components Per Hour)
Monthly Capacity Up to 500,000+ units / month
Minimum Component Size 01005 (0402 Metric)
BGA Minimum Pitch 0.35mm | uBGA, QFN, CSP supported
Placement Accuracy ±0.025mm (Cpk ≥ 1.67)
Solder Paste Lead-free (SAC305) & Leaded — RoHS compliant
Stencil Thickness 0.08mm — 0.20mm (laser-cut stainless steel)
Reflow Atmosphere Nitrogen (N₂) atmosphere available
Soldering Process Reflow, Wave, Selective, Hand Soldering
DIP / Through-hole Automated & semi-automated insertion lines
Board Size Min 50×50mm — Max 460×460mm
Board Thickness 0.4mm — 6.0mm
Production Volume 1 pc prototype to 500,000+ pcs/month — no MOQ
Lead Time (Prototype) 48 hours express available
Lead Time (Production) 15–20 working days (standard)
Inspection / Test Equipment & Standard
Solder Paste Inspection (SPI) 3D SPI — pre & post print verification
Automated Optical Inspection (AOI) 100% board coverage
X-Ray Inspection BGA, QFN, void ratio analysis
In-Circuit Testing (ICT) No fixture for prototypes
Functional Testing (FCT) Custom fixtures — real operating condition simulation
Burn-in Testing Extended thermal stress screening for reliability
Process Standard IPC-A-610 Class 2 & Class 3
Soldering Standard IPC J-STD-001
Quality Certifications ISO 9001:2015 · ISO 13485:2016 · ISO 14001:2015
Traceability Full batch tracking — FAI, SPC, COC reports available
NDA & IP Protection NDA signed before file receipt — restricted access controls
Service Details
DFM Analysis Free DFM review — BOM & Gerber verification before production
BOM Sourcing Authorized distributors only: Digi-Key, Mouser, Arrow, Avnet, Future Electronics
Conformal Coating Acrylic, silicone, polyurethane, epoxy — selective or full coverage
Potting & Encapsulation Full potting for harsh environment and waterproofing applications
IC Programming On-board and off-board IC programming services
Box Build Assembly Complete product assembly — enclosures, cables, final packaging
Quick Prototyping 48-hour express service available
Technical Support Engineering team available for DFM, BOM review, and process consultation
One-Stop Service Flow

From Files to Finished Product.

01

IQC

Incoming inspection of all PCBs and components.
02

Solder Paste Printing

SPI-verified precise paste application.
03

SMT Assembly

±0.025mm placement accuracy, 01005 capable.

04

Reflow Soldering

Nitrogen atmosphere, precise temperature profile.
05

Through-Hole (DIP)

Automated insertion with wave soldering.
06

Testing & Inspection

AOI, X-Ray, ICT, FCT, burn-in.
07

Conformal Coating

Coating, potting, IC programming, box build.
08

Final Packaging

Custom packaging with full traceability documentation.
One-Stop Service Flow

From Files to Finished Product.

Authorized distributors only. Full COC documentation, transparent BOM pricing, and early warnings for component shortages on every order.

Authorized Only

IQC

Partnerships with authorized distributors worldwide ensuring genuine components and stable supply.
Cost Optimization

BOM Optimization

Expert component substitution to reduce costs and mitigate supply chain risks.

Flexibility

Inventory Management

“Procure and manage” services to reduce your capital investment and storage needs.

Risk Control

Supply Chain Risk Control

Early warnings for component shortages and end-of-life parts to prevent production delays.

Testing & Quality Assurance

Quality Control.

Multi-stage inspection at every production step — from incoming materials to final shipment. IPC-A-610 Class 3 certified.

AOI

Automated Optical Inspection (AOI)

High-resolution cameras detect soldering defects and component placement issues.
X-Ray

X-Ray Inspection

Critical for BGA inspection, verifying solder joints and internal connections.
ICT

In-Circuit Testing (ICT)

Verifies component presence, orientation, and values for manufacturing defects.
FCT

Functional Testing (FCT)

Simulates real-world operating conditions to ensure proper functionality.

Burn-in

Burn-in Testing

Extended operation under elevated temperatures to identify early failures.

Standards

Quality Standards

Adherence to IPC-A-610 Class 2/3 standards with comprehensive documentation.